Host:

IBPSA-USA Chicago Chapter

Online

May 4, 2018

The Chicago Chapter of IBPSA-USA (CHIBPSA) invites you to join fellow
Chicago-area building simulation community members for a morning of
networking, discussion on innovative thermal

comfort solutions, and presentations by *Arjan Kraakman*
and *Remco van
Woensel* , both
graduate students of the *Building Physics & Services department*

of
the Eindhoven University of Technology. Arjan and Remco will present their
research on the effects of spatial transitions on thermal comfort
perception in office environments, and *SPONG3D*
, an adaptive 3D-printed
fa?ade system for seasonal thermal comfort optimization.

*Date & Time: *Fri, May 4, 2018; 7:00 AM - 8:00 PM PDT

*Register: https://register.gotowebinar.com/register/2653463896277375747?
*

*Presenter Bios:*

*Arjan Kraakman* is
a graduate student at TU Eindhoven?s Building Physics and Services
department. While his main area of focus involves the internet of things
and intelligent buildings, Arjan is experienced in building performance
analysis. *See Arjan's presentation poster*

.

*Remco van Woensel
* is a graduate
student at TU Eindhoven?s Building Physics and Services department. His
recent focus includes research on SPONG3D, *an adaptive 3D printed facade
system that integrates multiple functions to optimize thermal performances
according to the different environmental conditions throughout the year*. Remco
serves as treasurer for the Mollier Building Physics and Services
Association. *See Remco's presentation poster*

.